» » Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging)
eBook Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging) download
Engineering
Author: Lian-Tuu Yeh,Richard C. Chu,Dereje Agonafer
ISBN: 0791801683
Subcategory: Engineering
Pages 414 pages
Publisher ASME Press (American Society of Mechanical Engineers); 1st edition (September 1, 2002)
Language English
Category: Engineering
Rating: 4.5
Votes: 348
ePUB size: 1903 kb
FB2 size: 1164 kb
DJVU size: 1269 kb
Other formats: lrf azw mobi lrf

eBook Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging) download

by Lian-Tuu Yeh,Richard C. Chu,Dereje Agonafer


Series: Asme Press Book Series on Electronic Packaging. But this book is just like they were high and like "what if we made a book about our job, but we do it like we were studying in school.

Lian-Tuu Yeh. Hardcover. Series: Asme Press Book Series on Electronic Packaging. Sections like design of fins are severely lacking, and this book should be about 100 pages longer. I failed the exam, and now I have to drop the class to stay in the program.

Book · October 2002 with 43 Reads. A multiple-step procedure for the thermal simulation of electronic equipment of stack design is developed

Book · October 2002 with 43 Reads. Publisher: ASME Press. Cite this publication. A multiple-step procedure for the thermal simulation of electronic equipment of stack design is developed. An automated procedure for calculating temperature fields is examined along with a mathematical model describing heat transfer in the stacks. Some simulation results are presented. Derivation of design curve and working equations for estimating effects of either perfect or imperfect heat transfer in storage device are described. Mathematical models of heat transfer conditions are provided.

Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries. Download from free file storage.

Home Lian-Tuu Yeh Thermal Management of Microelectronic Equipment Heat Transfer. Title: Thermal Management of Microelectronic.

ASME Press Book Series on Electronic Packaging, D. Agonafer, Series .

The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. The authors are recognized experts in the field of thermal management of electronic systems and have a combined 80-plus years of experience in the defense and commercial industries.

Yeh L-T, Chu RC (2002) Thermal management of microelectronic equipment: heat transfer theory, analysis . Cite this chapter as: Chu . Iyengar . Yeh LT. (2013) Thermal Management of Flip Chip Packages.

Yeh L-T, Chu RC (2002) Thermal management of microelectronic equipment: heat transfer theory, analysis methods and design practices. ASME, New YorkCrossRefGoogle Scholar. 6. Howell JR, Siegal R, Menguc MP (2010) Thermal radiation heat transfer, 5th edn. CRC Press, New YorkGoogle Scholar. 7. Modest MF (2003) Radiative heat transfer, 2nd edn. Academic, New YorkGoogle Scholar. In: Tong H. Lai Y. Wong C. (eds) Advanced Flip Chip Packaging. Springer, Boston, MA.

While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.

Chu, Richard . Yeh, Lian-Tuu. This is a comprehensive book that addresses both thermal and mechanical reliabilities as well as energy efficiency in the design of all types of telecommunications equipment, including indoor and outdoor systems

Chu, Richard . This is a comprehensive book that addresses both thermal and mechanical reliabilities as well as energy efficiency in the design of all types of telecommunications equipment, including indoor and outdoor systems. This book places a great deal of emphasis on providing practical solutions to thermal issues facing today's telecommunications industry. Materials presented in the book are based on actual cases in design of all types of telecommunications equipment. This book is developed to serve many types of readers.

Management of Microelectronic Equipment : Heat Transfer Theory, Analysis Methods, and Design Practices. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems.

Thermal Management of Microelectronic Equipment : Heat Transfer Theory, Analysis Methods, and Design Practices. Electronic Packaging. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels.

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.