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eBook Handbook of Semiconductor Interconnection Technology download
Engineering
Author: Geraldine Cogin Shwartz,Geraldine C. Schwartz,Kris V. Srikrishnan
ISBN: 1574446746
Subcategory: Engineering
Pages 536 pages
Publisher CRC Press; 2 edition (February 22, 2006)
Language English
Category: Engineering
Rating: 4.2
Votes: 643
ePUB size: 1737 kb
FB2 size: 1559 kb
DJVU size: 1387 kb
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eBook Handbook of Semiconductor Interconnection Technology download

by Geraldine Cogin Shwartz,Geraldine C. Schwartz,Kris V. Srikrishnan


Geraldine Cogin Shwartz, Geraldine C. Schwartz, Kris V. Srikrishnan.

Geraldine Cogin Shwartz, Geraldine C.

Find many great new & used options and get the best deals for Handbook of Semiconductor Interconnection Technology . Additional Product Features. Kris V. Srikrishnan, Arthur Bross, Geraldine Cogin Schwartz. Place of Publication.

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Home . Details for: Handbook of semiconductor interconnection technology . 26 c. SBN: 0824799666 (acid-free paper). Other title: Semiconductor interconnection technology. Details for: Handbook of semiconductor interconnection technology /. Normal view MARC view ISBD view. Subject(s): Semiconductors - Design and construction Electric contacts Semiconductors - JunctionsDDC classification: 62. 8152 Online resources: Publisher description Catalogued By: Mahitab. Tags from this library: No tags from this library for this title.

First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in thisEdition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability